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R5F5630BDGFB

Renesas
Part Number R5F5630BDGFB
Manufacturer Renesas
Description MCU
Published Aug 13, 2020
Detailed Description Features DATASHEET RX630 Group Renesas MCUs R01DS0060EJ0160 Rev.1.60 100-MHz 32-bit RX MCU, on-chip FPU, 165 DMIPS...
Datasheet PDF File R5F5630BDGFB PDF File

R5F5630BDGFB
R5F5630BDGFB


Overview
Features DATASHEET RX630 Group Renesas MCUs R01DS0060EJ0160 Rev.
1.
60 100-MHz 32-bit RX MCU, on-chip FPU, 165 DMIPS, May 19, 2014 up to 2-MB flash memory, USB 2.
0 full-speed function interface, CAN, 10- & 12-bit A/D converter, RTC, up to 22 comms interfaces Features ■ 32-bit RX CPU core  Max.
operating frequency: 100 MHz Capable of 165 DMIPS in operation at 100 MHz  Single precision 32-bit IEEE-754 floating point  Two types of multiply-and-accumulation unit (between memories and between registers)  32-bit multiplier (fastest instruction execution takes one CPU clock cycle)  Divider (fastest instruction execution takes two CPU clock cycles)  Fast interrupt  CISC Harvard architecture with 5-stage pipeline  Variable-length instructions: Ultra-compact code  Supports the memory protection unit (MPU)  Two types of debugging interfaces: JTAG and FINE (two-line) ■ Low-power design and architecture  Operation from a single 2.
7- to 3.
6-V supply  Low power consumption: A product that supports all peripheral functions draws only 500 μA/MHz.
 RTC is capable of operation from a dedicated power supply (min.
operating voltage: 2.
3 V).
 Four low-power modes ■ On-chip main flash memory, no wait states  100-MHz operation, 10-ns read cycle (no wait states)  384-Kbyte to 2-Mbyte capacities  User code is programmable by on-board or off-board programming.
■ On-chip data flash memory  Max.
32 Kbytes, reprogrammable up to 100,000 times  Programming/erasing as background operations (BGOs) ■ On-chip SRAM, no wait states  32- to 128-Kbyte capacities  For instructions and operands  Can provide backup on deep software standby ■ DMA  DMAC: Incorporates four channels  DTC ■ Reset and supply management  Power-on reset (POR)  Low voltage detection (LVD) with voltage settings ■ Clock functions  External crystal oscillator or internal PLL for operation at 4 to 16 MHz  Internal 125-kHz LOCO and 50-MHz HOCO  125-kHz clock for the IWDT  Frequency of the oscillator f...



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