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W25Q32JVXGIM

Winbond

3V 32M-BIT SERIAL FLASH MEMORY

W25Q32JV-DTR 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI & DTR Publication Release Date: February 24, 2017 R...


Winbond

W25Q32JVXGIM

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W25Q32JV-DTR 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI & DTR Publication Release Date: February 24, 2017 Revision F W25Q32JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 4 2. FEATURES....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm ............................................................ 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm, XSON 4x4-mm ......................................... 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil............................................................................................... 6 3.1 Ball Configuration TFBGA 8x6-mm (6x4 Ball Array) ............................................................ 7 3.2 Ball Description TFBGA 8x6-mm ......................................................................................... 7 4. PIN DESCRIPTIONS .............................................................................




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