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W25Q32FVSSIQ

Winbond
Part Number W25Q32FVSSIQ
Manufacturer Winbond
Description 3V 32M-BIT SERIAL FLASH MEMORY
Published Dec 18, 2020
Detailed Description W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: June 03, 2016 Revision J W25...
Datasheet PDF File W25Q32FVSSIQ PDF File

W25Q32FVSSIQ
W25Q32FVSSIQ

Overview
W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: June 03, 2016 Revision J W25Q32FV Table of Contents 1.
GENERAL DESCRIPTIONS.
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5 2.
FEATURES 5 3.
PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.
1 Pin Configuration SOIC 208-mil / VSOP 208-mil.
6 3.
2 Pad Configuration WSON 6x5-mm / 8x6-mm 6 3.
3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .
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6 3.
4 Pin Configuration SOIC 300-mil .
7 3.
5 Pin Description SOIC 300-mil 7 3.
6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) .
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8 3.
7 Ball Description TFBGA 8x6-mm .
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8 3.
8 Pin Configuration PDIP 300-mil .
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9 3.
9 Pin Description PDIP 300-mil 9 4.
PIN DESCRIPTIONS .
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10 4.
1 Chip Select (/CS) .
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10 4.
2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3).
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