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W25Q64FVZEIG

Winbond

3V 64M-BIT SERIAL FLASH MEMORY

W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 18, 2017 -1 Revision ...


Winbond

W25Q64FVZEIG

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W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 18, 2017 -1 Revision S W25Q64FV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm ........................................... 6 3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm, XSON 4x4-mm and PDIP 300mil 7 3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.6 Pin Description SOIC 300-mil ............................................................................................... 8 3.7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9 3.8 Ball Description TFBGA 8x6-mm ......................................................................................... 9 3.9 Bal...




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