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25Q01JVFIM

Winbond

3.0V 1G-BIT SERIAL FLASH MEMORY

W25Q01JV-DTR 3.0V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: November...


Winbond

25Q01JVFIM

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W25Q01JV-DTR 3.0V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: November 13. 2019 -Revision B1 W25Q01JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS........................................................................................................ 5 2. FEATURES ................................................................................................................................. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ...................................................................... 6 3.1 Pad Configuration WSON 8x6-mm .................................................................................. 6 3.2 Pad Description WSON 8x6-mm ..................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ....................................................................................... 7 3.4 Pin Description SOIC 300-mil .......................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) ......................................................... 8 3.6 Ball Description TFBGA 8x6-mm ..................................................................................... 8 4. PIN DESCRIPTIONS................................................................................................................. 10 4.1 Chip Select (/CS) ..............................................




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