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25Q01JVFIM

Winbond
Part Number 25Q01JVFIM
Manufacturer Winbond
Description 3.0V 1G-BIT SERIAL FLASH MEMORY
Published Dec 18, 2020
Detailed Description W25Q01JV-DTR 3.0V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: November...
Datasheet PDF File 25Q01JVFIM PDF File

25Q01JVFIM
25Q01JVFIM


Overview
W25Q01JV-DTR 3.
0V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: November 13.
2019 -Revision B1 W25Q01JV-DTR Table of Contents 1.
GENERAL DESCRIPTIONS.
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.
.
5 2.
FEATURES .
.
.
.
5 3.
PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.
1 Pad Configuration WSON 8x6-mm .
.
6 3.
2 Pad Description WSON 8x6-mm 6 3.
3 Pin Configuration SOIC 300-mil .
.
7 3.
4 Pin Description SOIC 300-mil 7 3.
5 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) .
.
8 3.
6 Ball Description TFBGA 8x6-mm 8 4.
PIN DESCRIPTIONS.
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.
10 4.
1 Chip Select (/CS) .
.
10 4.
2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .
10 4.
3 Write Protect (/WP).
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.
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10 4.
4 HOLD (/HOLD) 10 4.
5 Serial Clock (CLK) .
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.
...


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