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W25Q16DWUUIP

Winbond
Part Number W25Q16DWUUIP
Manufacturer Winbond
Description 1.8V 16M-BIT SERIAL FLASH MEMORY
Published Dec 18, 2020
Detailed Description W25Q16DW 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: September 1, 2014 -1- Re...
Datasheet PDF File W25Q16DWUUIP PDF File

W25Q16DWUUIP
W25Q16DWUUIP

Overview
W25Q16DW 1.
8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: September 1, 2014 -1- Revision J W25Q16DW Table of Contents 1.
GENERAL DESCRIPTION .
5 2.
FEATURES 5 3.
PACKAGE TYPES AND PIN CONFIGURATIONS .
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6 3.
1 Pin Configuration SOIC 150 / 208-mil .
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6 3.
2 Pad Configuration WSON 6x5-mm, USON 4x3-mm 6 3.
3 Pin Description SOIC 150 / 208-mil, WSON 6x5-mm, USON 4x3-mm .
6 3.
4 Ball Configuration WLCSP .
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7 3.
5 Ball Description WLCSP.
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7 3.
6 Pin Configuration SOIC16 300-mil .
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8 3.
7 Pin Description SOIC16 300-mil.
8 4.
PIN DESCRIPTIONS 9 4.
1 Chip Select (/CS).
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9 4.
2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .
9 4.
3 Write Protect (/WP).
9 4.
4 HOLD (/HOLD) .
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