DatasheetsPDF.com

W25Q32JWZPIQ

Winbond
Part Number W25Q32JWZPIQ
Manufacturer Winbond
Description 1.8V 32M-BIT SERIAL FLASH MEMORY
Published Dec 18, 2020
Detailed Description W25Q32JW 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: December 12, 2019 -Revision G W...
Datasheet PDF File W25Q32JWZPIQ PDF File

W25Q32JWZPIQ
W25Q32JWZPIQ

Overview
W25Q32JW 1.
8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: December 12, 2019 -Revision G W25Q32JW Table of Contents 1.
GENERAL DESCRIPTIONS .
.
.
.
4 2.
FEATURES .
.
.
.
4 3.
PACKAGE TYPES AND PIN CONFIGURATIONS .
5 3.
1 Pin Configuration SOIC 150-mil / 208-mil .
.
.
5 3.
2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm .
.
.
5 3.
3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm .
.
.
5 3.
4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) .
.
6 3.
5 Ball Description TFBGA 8x6-mm...


Similar Datasheet


Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)