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TLP241BF

Toshiba
Part Number TLP241BF
Manufacturer Toshiba
Description Photocouplers Photorelay
Published Jan 15, 2021
Detailed Description Photocouplers Photorelay TLP241B,TLP241BF TLP241B,TLP241BF 1. Applications • Mechanical relay replacements • Security ...
Datasheet PDF File TLP241BF PDF File

TLP241BF
TLP241BF


Overview
Photocouplers Photorelay TLP241B,TLP241BF TLP241B,TLP241BF 1.
Applications • Mechanical relay replacements • Security Systems • Heating, ventilation and air conditioning (HVAC) • ATE (Automatic Test Equipment) • Factory Automation (FA) • Battery Management System (BMS) (Non-Automotive) 2.
General The TLP241B and TLP241BF photorelay consist of a photo MOSFET optically coupled to an infrared light emitting diode.
They are housed in a 4-pin DIP package.
They provide an isolation voltage of 5000 Vrms, making them suitable for applications that require reinforced insulation.
3.
Features (1) Halogen-free For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet.
(2) Normally opened (1-Form-A) (3) OFF-state output terminal voltage: 100 V (min) (4) Trigger LED current: 3 mA (max) (5) ON-state current: 2.
0 A (max) (6) ON-state resistance: 200 mΩ (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards UL-recognized: UL 1577, File No.
E67349 cUL-recognized: CSA Component Acceptance Service No.
5A File No.
E67349 VDE-approved: EN 60747-5-5 (Note 1) Note 1: When an EN 60747-5-5 approved type is needed, please designate the Option (D4).
4.
Mechanical Parameters Characteristics Creepage distances Clearance distances Internal isolation thickness 7.
62-mm Pitch TLP241B 7.
0 (min) 7.
0 (min) 0.
4 (min) 10.
16-mm Pitch TLP241BF Unit 8.
0 (min) mm 8.
0 (min) 0.
4 (min) ©2020 1 Toshiba Electronic Devices & Storage Corporation Start of commercial production 2020-12 2020-12-02 Rev.
1.
0 5.
Packaging (Note) TLP241B TLP241B(LF1,TP1) TLP241B,TLP241BF TLP241B(LF5,TP5) 11-5B2S TLP241BF 11-5B201S TLP241BF(LF4,TP4) 11-5B205S 11-5B202S 11-5B204S Note: Through-hole type: TLP241B, TLP241BF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6.
Pin Assignment 1: Anode 2: Cathode 3: Drain 4: Drain 7.
Internal Circuit ©2020 2 Toshiba Electronic Devices & Storage Corporation 2020-12-02 Rev.
1.
0 TLP241B,TLP241BF 8.
Absolute Maximu...



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