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TC358764XBG

Toshiba
Part Number TC358764XBG
Manufacturer Toshiba
Description Mobile Peripheral
Published Jan 20, 2021
Detailed Description TC358764XBG/TC358765XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358764XBG/TC358765XBG Mobile Peripheral D...
Datasheet PDF File TC358764XBG PDF File

TC358764XBG
TC358764XBG

Overview
TC358764XBG/TC358765XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358764XBG/TC358765XBG Mobile Peripheral Devices Overview TC358764XBG The primary function of TC358764XBG/TC358765XBG is DSI-to-LVDS Bridge, enabling video streaming output over DSI link to drive LVDS-compatible display panels.
The chip supports up to 1366×768 24-bit pixel resolution for single-link LVDS and up to WUXGA (1920x1200 18-bit pixels) resolution for dual-link LVDS.
As a secondary function, the chip also supports an I2C Master which is controlled by the DSI link; this may be used as an interface to any other control functions through I2C.
The chip can be configured through the DSI link by sending write register commands through DSI Generic Long Write-packets.
It can also be configured through the I2C Slave interface.
P-TFBGA49-0505-0.
65AZ Weight: 53 mg (Typ.
) TC358765XBG Features ● DSI Receiver  Configurable 1- up to 4-Data-Lane DSI Link with bi-directional support on Data Lane 0  Maximum bit...


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