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SN74AUC1G126

Texas Instruments
Part Number SN74AUC1G126
Manufacturer Texas Instruments
Description Single Bus Buffer Gate
Published Aug 31, 2021
Detailed Description Product Folder Order Now Technical Documents Tools & Software Support & Community SN74AUC1G126 SCES383L – MARCH 200...
Datasheet PDF File SN74AUC1G126 PDF File

SN74AUC1G126
SN74AUC1G126

Overview
Product Folder Order Now Technical Documents Tools & Software Support & Community SN74AUC1G126 SCES383L – MARCH 2002 – REVISED JANUARY 2018 SN74AUC1G126 Single Bus Buffer Gate With Tri-state Output 1 Features •1 Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) • Available in TI's NanoFree™ Package • Optimized for 1.
8-V Operation and is 3.
6-V I/O Tolerant to Support Mixed-Mode Signal Operation • Ioff Supports Partial Power Down Mode and Back Drive Protection • Sub-1 V Operable • Maximum tpd of 2.
5 ns at 1.
8 V • Low Power Consumption, 10-µA Maximum ICC • ±8-mA Output Drive at 1.
8 V 2 Applications • AV Receiver • Audio Dock: Portable • Blu-ray™ Player and Home Theater • Embedded PC • MP3 Player/Recorder (Portable Audio) • Personal Digital Assistant (PDA) • Power: AC/DC Supply, Single Controller • Solid State Drive (SSD): Client and Enterprise • TV: LCD, Digital, and High-Definition (HD) • Tablet: Enterprise • Video Analytics: Server • Wireless Headset, Keyboard, and Mouse 3 Description The SN74AUC1G126 bus buffer gate is operational at 0.
8-V to 2.
7-V VCC, but is designed specifically for 1.
65-V to 1.
95-V VCC operation.
The SN74AUC1G126 device is a single line driver with a tri-state output.
The output is disabled when the output-enable (OE) input is low.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoFree™ package technology is a major breakthrough in device packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff.
The Ioff circuitry disables the outputs, which prevents damaging current backflow through the device when it is powered down.
Device Information(1) PART NUMBER PACK...


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