DatasheetsPDF.com

FDC658P

ON Semiconductor
Part Number FDC658P
Manufacturer ON Semiconductor
Description P-Channel MOSFET
Published Dec 12, 2021
Detailed Description MOSFET – Single, P-Channel, Logic Level, POWERTRENCH) FDC658P General Description This P−Channel Logic Level MOSFET is ...
Datasheet PDF File FDC658P PDF File

FDC658P
FDC658P

Overview
MOSFET – Single, P-Channel, Logic Level, POWERTRENCH) FDC658P General Description This P−Channel Logic Level MOSFET is produced using onsemi’s advanced POWERTRENCH process that has been especially tailored to minimize the on−state resistance and yet maintain low gate charge for superior switching performance.
These devices are well suited for notebook computer applications: load switching and power management, battery charging circuits, and DC/DC conversion.
Features • −4 A, −30 V ♦ RDS(ON) = 0.
050 W @ VGS = −10 V ♦ RDS(ON) = 0.
075 W @ VGS = −4.
5 V • Low Gate Charge (8 nC Typical) • High Performance Trench Technology for Extremely Low RDS(ON) • SUPERSOTt−6 Package: Small Footprint (72% Smaller than Standard SO−8); Low Profile (1 mm Thick) • This is a Pb−Free Device ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise noted) Symbol Parameter Value Unit VDSS Drain−Source Voltage −30 V VGSS Gate−Source Voltage − Continuous ±20 V ID Drain Current − Continuous (Note 1a) −4 A − Pulsed −20 PD Maximum Power Dissipation (Note 1a) 1.
6 W (Note 1b) 0.
8 TJ, TSTG Operating and Storage Temperature Range −55 to 150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device.
If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (TA = 25°C, unless otherwise noted) Symbol Parameter Max Unit RqJA Thermal Resistance, Junction−to−Ambient (Note 1a) 78 °C/W RqJA Thermal Resistance, Junction−to−Case (Note 1) 30 °C/W 1.
RqJA is the sum of the junction−to−case and case−to−ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
RqJC is guaranteed by design while RqCA is determined by the user’s board design.
a.
78°C/W when mounted on a 1 in2 pad of 2 oz Cu on FR−4 board.
b.
156°C/W when mounted on a minimum pad of 2 oz Cu on FR−4 board.
DATA SHEET www.
onsemi.
com V...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)