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TLV2221Y

Texas Instruments
Part Number TLV2221Y
Manufacturer Texas Instruments
Description Very Low-Power Single Operational Amplifiers
Published Jan 8, 2022
Detailed Description TLV2221, TLV2221Y Advanced LinCMOS RAILĆTOĆRAIL VERY LOWĆPOWER SINGLE OPERATIONAL AMPLIFIERS SLOS157B − JUNE1996 − REVI...
Datasheet PDF File TLV2221Y PDF File

TLV2221Y
TLV2221Y


Overview
TLV2221, TLV2221Y Advanced LinCMOS RAILĆTOĆRAIL VERY LOWĆPOWER SINGLE OPERATIONAL AMPLIFIERS SLOS157B − JUNE1996 − REVISED APRIL 2005 D Output Swing Includes Both Supply Rails D Low Noise .
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19 nV/√Hz Typ at f = 1 kHz D Low Input Bias Current .
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1 pA Typ D Fully Specified for Single-Supply 3-V and 5-V Operation D Very Low Power .
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110 µA Typ D Common-Mode Input Voltage Range Includes Negative Rail D Wide Supply Voltage Range 2.
7 V to 10 V D Macromodel Included DBV PACKAGE (TOP VIEW) IN + 1 5 VDD+ VDD− /GND 2 IN − 3 4 OUT description The TLV2221 is a single low-voltage operational amplifier available in the SOT-23 package.
It offers a compromise between the ac performance and output drive of the TLV2231 and the micropower TLV2211.
It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications.
The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications.
The TLV2221 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2221, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers.
Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications.
In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs).
With a total area of 5.
6mm2, the SOT-23 package only requires one third the board space of the standard 8-pin SOIC package.
This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces.
TI has also taken special care to provide a pinout that is optimized for board layout (see Figure 1).
Both inputs are separated by GND to prevent coupling or leakage...


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