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TLV2231Y

Texas Instruments
Part Number TLV2231Y
Manufacturer Texas Instruments
Description Low-Power Single Operational Amplifiers
Published Jan 8, 2022
Detailed Description TLV2231, TLV2231Y Advanced LinCMOS RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS SLOS158D – JUNE 1996 – REVISED ...
Datasheet PDF File TLV2231Y PDF File

TLV2231Y
TLV2231Y

Overview
TLV2231, TLV2231Y Advanced LinCMOS RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS SLOS158D – JUNE 1996 – REVISED APRIL 2001 D Output Swing Includes Both Supply Rails D Low Noise .
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15 nV/√Hz Typ at f = 1 kHz D Low Input Bias Current .
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1 pA Typ D Fully Specified for Single-Supply 3-V and 5-V Operation D Common-Mode Input Voltage Range Includes Negative Rail D High Gain Bandwidth .
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2 MHz at VDD = 5 V With 600-Ω Load D High Slew Rate .
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1.
6 V/µs at VDD = 5 V D Wide Supply Voltage Range 2.
7 V to 10 V D Macromodel Included DBV PACKAGE (TOP VIEW) IN + 1 5 VDD+ VDD– /GND 2 IN – 3 4 OUT description The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package.
It offers 2 MHz of bandwidth and 1.
6 V/µs of slew rate for applications requiring good ac performance.
The device exhibits rail-to-rail output performance for increased dynamic range in single or split supply applications.
The TLV2231 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of high-impedance sources, such as piezoelectric transducers.
Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications.
In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs).
The device can also drive 600-Ω loads for telecom applications.
With a total area of 5.
6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package.
This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces.
TI has also taken special care to provide a pinout that is optimized for board layout (see Figure 1).
Both inputs are separated by G...


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