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NTK3142P

ON Semiconductor
Part Number NTK3142P
Manufacturer ON Semiconductor
Description Small Signal MOSFET
Published Feb 5, 2023
Detailed Description NTK3142P Small Signal MOSFET −20 V, −280 mA, P−Channel with ESD Protection, SOT−723 Features • Enables High Density PCB...
Datasheet PDF File NTK3142P PDF File

NTK3142P
NTK3142P



Overview
NTK3142P Small Signal MOSFET −20 V, −280 mA, P−Channel with ESD Protection, SOT−723 Features • Enables High Density PCB Manufacturing • 44% Smaller Footprint than SC−89 and 38% Thinner than SC−89 • Low Voltage Drive Makes this Device Ideal for Portable Equipment • Low Threshold Levels, 1.
8 V RDS(on) Rating • Low Profile (< 0.
5 mm) Allows It to Fit Easily into Extremely Thin Environments such as Portable Electronics • Operated at Standard Logic Level Gate Drive, Facilitating Future Migration to Lower Levels Using the Same Basic Topology.
• This is a Pb−Free Device Applications • Interfacing, Switching • High Speed Switching • Cellular Phones, PDA’s http://onsemi.
com V(BR)DSS −20 V RDS(on) TYP 2.
7 W @ −4.
5 V 4.
1 W @ −2.
5 V 6.
1 W @ −1.
8 V ID Max −280 mA SOT−723 (3−LEAD) 3 MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Parameter Symbol Value Unit Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain Current (Note 1) Power Dissipation (Note 1) Continuous Drain Current (Note 2) Power Dissipation (Note 2) Steady State tv5s Steady State tv5s Steady State TA = 25°C TA = 85°C TA = 25°C TA = 25°C TA = 25°C TA = 85°C TA = 25°C VDSS VGS ID PD ID PD −20 V ±8.
0 V −260 −185 mA −280 400 mW 500 −215 mA −155 280 mW Pulsed Drain Current tp = 10 ms Operating Junction and Storage Temperature Source Current (Body Diode) (Note 2) Lead Temperature for Soldering Purposes (1/8” from case for 10 s) IDM TJ, TSTG IS TL −310 mA −55 to 150 °C −240 mA 260 °C Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.
127 in sq [1 oz] including traces) 2.
Surface−mounted on FR4 board using the minimum recommended pad size.
1 2 1 − Gate 2 − Source 3 − Drain Top View MARK...



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