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MM74HC08

ON Semiconductor
Part Number MM74HC08
Manufacturer ON Semiconductor
Description Quad 2-Input AND Gate
Published Sep 3, 2023
Detailed Description Quad 2-Input AND Gate MM74HC08 General Description The MM74HC08 AND gates utilize advanced silicon−gate CMOS technology...
Datasheet PDF File MM74HC08 PDF File

MM74HC08
MM74HC08

Overview
Quad 2-Input AND Gate MM74HC08 General Description The MM74HC08 AND gates utilize advanced silicon−gate CMOS technology to achieve operating speeds similar to LS−TTL gates with the low power consumption of standard CMOS integrated circuits.
The HC08 has buffered outputs, providing high noise immunity and the ability to drive 10 LS−TTL loads.
The 74HC logic family is functionally as well as pin−out compatible with the standard 74LS logic family.
All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground.
Features • Typical Propagation Delay: 12 ns (tPHL), 7 ns (tPLH) • Fan−out of 10 LS−TTL Loads • Quiescent Power Consumption: 2 mA Maximum at Room Temperature • Low Input Current: 1 mA Maximum • This Device is Pb−Free and Halide Free Connection Diagram VCC B4 A4 Y4 B3 14 13 12 11 10 A3 Y3 9 8 1 2 A1 B1 3 4 5 Y1 A2 B2 Top View 6 7 Y2 GND DATA SHEET www.
onsemi.
com 14 1 SOIC−14 NB CASE 751A−03 14 1 SOIC14 CASE 751EF 14 1 TSSOP−14 WB CASE 948G−01 MARKING DIAGRAMS SOIC−14 14 HC08A AWLYWW 1 TSSOP−14 14 HC 08A ALYWG G 1 HC08A A WL, L Y WW, YW = Specific Device Code = Assembly Location = Wafer Lot Number = Year = Work Week ORDERING INFORMATION See detailed ordering and shipping information on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 1983 1 December, 2022 − Rev.
2 Publication Order Number: MM74HC08/D MM74HC08 ABSOLUTE MAXIMUM RATINGS (Note 1) Symbol Rating Min Max Unit VCC Supply Voltage −0.
5 +7.
0 V VIN DC Input Voltage −0.
5 VCC + 0.
5 V VOUT DC Output Voltage −0.
5 VCC + 0.
5 V IIK, IOK Clamp Diode Current ±20 mA IOUT DC Output Current, per pin ±25 mA ICC DC VCC or GND Current, per pin ±50 mA TSTG Storage Temperature Range −65 +150 °C PD Power Dissipation SOIC Package only 500 mW TL Lead Temperature (Soldering 10 second) 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device.
If any of thes...


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