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SM1003

Microsemi
Part Number SM1003
Manufacturer Microsemi
Description MELF PIN Diodes
Published Feb 12, 2024
Detailed Description ® TM DESCRIPTION This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with f...
Datasheet PDF File SM1003 PDF File

SM1003
SM1003

Overview
® TM DESCRIPTION This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction.
The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations.
The PIN diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the reliability resulting in MTBFs of greater than one million hours.
RoHS compliant versions of these products meet RoHS requirements per EU Directive 2002/95/EC.
The standard terminal finish is gold unless otherwise specified.
Consult the factory if you have special requirements.
SM0502 – SM1003 CONTROL DEVICES Surface Mount – MELF PIN Diodes RoHS Compliant Versions .
KEY FEATURES ƒ Non-Magnetic1 Versions Ideal for MRI Applications ƒ Very Low Inductance, Full Face Bonding ƒ Hi-Rel Hermetic Design ƒ Surface Mount Devices Available in Tape and Reel ƒ RoHS Compliant2 Versions Available www.
MICROSEMI.
com APPLICATIONS The MELF diodes are used as switching, attenuating and phase shifting elements from HF through 2 GHz and have breakdown voltage ratings up to 500 volts.
‘Non-magnetic1’ .
Cer-Met.
(MELFs) are also used as switching elements in MRI (magnetic resonance imaging).
Conventional Magnetic MELF packages are used in Cellular, Beam Steering units (telephone via satellites) surface mount applications, and Filter Switch banks for Frequency Hopping Radios.
ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) Rating Symbol Value Unit Maximum Leakage Current @80% of Minimum Rated VB IR 500 nA Forward Current (1us Pulse) IF 1 A Storage Temperature TSTG -55 to +150 ºC Operating Temperature TOP -55 to +150 ºC Maximum Solder Temperature 260 ºC APPLICATIONS/BENEFITS ƒ Designed for Low Loss – Low Distortion Applications ƒ Switch – Filter Bank ƒ T/R Control ƒ Attenuators ƒ MRI Switching IMPORTANT: For the most current data, ...


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