DatasheetsPDF.com

TMP88CU74FG

Toshiba
Part Number TMP88CU74FG
Manufacturer Toshiba
Description 8-Bit Microcontroller
Published Feb 26, 2024
Detailed Description TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870/X Series TMP88CU74FG Semiconductor Company TMP88CU74 Document Chan...
Datasheet PDF File TMP88CU74FG PDF File

TMP88CU74FG
TMP88CU74FG

Overview
TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870/X Series TMP88CU74FG Semiconductor Company TMP88CU74 Document Change Notification ç ç The purpose of this notification is to inform customers about the launch of the Pb-free version of the device.
The introduction of a Pb-free replacement affects the datasheet.
Please understand that this notification is intended as a temporary substitute for a revision of the datasheet.
Changes to the datasheet may include the following, though not all of them may apply to this particular device.
ç 1.
Part number Example: TMPxxxxxxF ˠ TMPxxxxxxFG All references to the previous part number were left unchanged in body text.
The new part number is indicated on the prelims pages (cover page and this notification).
ç 2.
Package code and package dimensions Example: LQFP100-P-1414-0.
50C ˠ LQFP100-P-1414-0.
50F All references to the previous package code and package dimensions were left unchanged in body text.
The new ones are indicated on the prelims pages.
ç 3.
Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added.
ç 4.
RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text.
A new replacement is included on the next page.
ç 5.
Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device.
I 2008-03-06 TMP88CU74 1.
Part number 2.
Package code and dimensions Previous Part Number Previous Package Code (in Body Text) (in Body Text) New Part Number New Package Code OTP TMP88CU74F P-QFP80-1420-0.
80B TMP88CU74FG QFP80-P-1420-0.
80B TMP88PU74FG *: For the dimensions of the new package, see the attached Package Dimensions diagram.
3.
Addition of notes on lead solderability The following solderability test is conducted on the new device.
Lead solderability of Pb-free devices (with the G suffix) Test Solderability Test Conditions (1) Use of Lead (Pb...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)