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HYB3116400BJ-60

Siemens Semiconductor Group
Part Number HYB3116400BJ-60
Manufacturer Siemens Semiconductor Group
Description 3.3V 4M x 4-Bit Dynamic RAM
Published Mar 26, 2005
Detailed Description 3.3V 4M x 4-Bit Dynamic RAM HYB3116400BJ/BT(L) -50/-60/-70 HYB3117400BJ/BT(L) -50/-60/-70 Advanced Information • • • ...
Datasheet PDF File HYB3116400BJ-60 PDF File

HYB3116400BJ-60
HYB3116400BJ-60

Overview
3.
3V 4M x 4-Bit Dynamic RAM HYB3116400BJ/BT(L) -50/-60/-70 HYB3117400BJ/BT(L) -50/-60/-70 Advanced Information • • • 4 194 304 words by 4-bit organization 0 to 70 °C operating temperature Performance: -50 tRAC tCAC tAA tRC tPC RAS access time CAS access time Access time from address Read/Write cycle time Fast page mode cycle time 50 13 25 90 35 -60 60 15 30 110 40 -70 70 20 35 130 45 ns ns ns ns ns • • • • • • • • Single + 3.
3 V (± 0.
3V ) supply Low power dissipation max.
396 active mW (HYB3117400BJ/BT-50) max.
363 active mW (HYB3117400BJ/BT-60) max.
330 active mW (HYB3117400BJ/BT-70) max.
360 active mW (HYB3116400BJ/BT-50) max.
324 active mW (HYB3116400BJ/BT-60) max.
288 active mW (HYB3116400BJ/BT-70) 7.
2 mW standby (LV-TTL) 3.
6 mW standby (LV-CMOS) 720 µW standby for L-version Output unlatched at cycle end allows two-dimensional chip selection Read, write, read-modify-write, CAS-before-RAS refresh, RAS-only refresh, hidden refresh, Self Refresh and test mode Fast page mode capability All inputs, outputs and clocks fully TTL-compatible 2048 refresh cycles / 32 ms for HYB3117400 4096 refresh cycles / 64 ms for HYB3116400 Plastic Package: P-SOJ-26/24-1 (300 mil) P-TSOPII-26/24-1 (300mil) Semiconductor Group 1 1.
96 HYB 3116(7)400BJ/BT(L) -50/-60/-70 3.
3V 4Mx4-DRAM The HYB 3116(7)400BJ/BT is a 16MBit dynamic RAM organized as 4194304 words by 4-bits.
The HYB 3116(7)400BJ/BT utilizes a submicron CMOS silicon gate process technology, as well as advanced circuit techniques to provide wide operating margins, both internally and for the system user.
Multiplexed address inputs permit the HYB 3116(7)400BJ/BT to be packaged in a standard SOJ 26/24 300 mil or TSOPII-26/24 300 mil wide plastic package.
These packages provide high system bit densities and are compatible with commonly used automatic testing and insertion equipment.
System-oriented features include single + 3.
3 V (± 0.
3 V) power supply, direct interfacing with high-performance logic device families.
The HY...


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