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AM50DLI28BG

Advanced Micro Devices
Part Number AM50DLI28BG
Manufacturer Advanced Micro Devices
Description Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Published Mar 26, 2005
Detailed Description Am50DL128BG Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both...
Datasheet PDF File AM50DLI28BG PDF File

AM50DLI28BG
AM50DLI28BG

Overview
Am50DL128BG Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu.
Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications There is no change to this datasheet as a result of offering the device as a Spansion product.
Any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported.
Future routine revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”.
To order these products, please use only the Ordering Part Numbers listed in this document.
For More Information Please contact your local AMD or Fujitsu sales office for additional information about Spansion memory solutions.
Publication Number 26089 Revision A Amendment +3 Issue Date January 8, 2002 PRELIMINARY Am50DL128BG Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.
0 Volt-only, Simultaneous Operation Flash Memories and 32 Mbit (2 M x 16-Bit) Pseudo Static RAM with Page Mode DISTINCTIVE CHARACTERISTICS MCP Features ■ Power supply voltage of 2.
7 to 3.
3 volt ■ High performance — Access time as fast as 70 ns ■ 20 year data retention at 125°C — Reliable operation for the life of the system SOFTWARE FEATURES ■ Data Management Software (DMS) — AMD-supplied software manages data programming, enabling EEPROM emulation — Eases historical sector erase flash limitations ■ Package — 73-Ball FBGA ■ Operating Temperature — –40°C to +85°C ■ Supports Common Flash Memory Interface (CFI) ■ Program/Erase Suspend/Erase Resume — Suspends program/erase operations to allow programming/erasing ...


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