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K4S281632C-TI1H

Samsung semiconductor
Part Number K4S281632C-TI1H
Manufacturer Samsung semiconductor
Description 128Mbit SDRAM 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL
Published Apr 7, 2005
Detailed Description K4S281632C-TI(P) CMOS SDRAM 128Mbit SDRAM 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 June 2001 * Samsu...
Datasheet PDF File K4S281632C-TI1H PDF File

K4S281632C-TI1H
K4S281632C-TI1H


Overview
K4S281632C-TI(P) CMOS SDRAM 128Mbit SDRAM 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.
1 June 2001 * Samsung Electronics reserves the right to change products or specification without notice.
Rev.
0.
1 Jun.
2001 K4S281632C-TI(P) Revision History Revision 0.
0 (November 18, 2000) • First generation.
CMOS SDRAM Revision 0.
1 (June 20, 2001) • Final Specification.
Rev.
0.
1 Jun.
2001 K4S281632C-TI(P) 2M x 16Bit x 4 Banks Synchronous DRAM FEATURES • JEDEC standard 3.
3V power supply • LVTTL compatible with multiplexed address • Four banks operation • MRS cycle with address key programs -.
CAS latency (2 & 3) -.
Burst length (1, 2, 4, 8 & Full page) -.
Burst type (Sequential & Interleave) • All inputs are sampled at the positive going edge of the system clock.
• Burst read single-bit write operation • DQM for masking • Auto & self refresh • 64ms refresh period (4K cycle) • Industrial Temperature Operation (- 40 to 85 °C) CMOS SDRAM GENERAL DESCRIPTION The K4S281632C is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x 2,097,152 words by 16 bits, fabricated with SAMSUNG′s high performance CMOS technology.
Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clock cycle.
Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.
ORDERING INFORMATION Part No.
K4S281632C-TI/P75 K4S281632C-TI/P1H K4S281632C-TI/P1L Max Freq.
133MHz(CL=3) 100MHz(CL=2) 100MHz(CL=3) LVTTL Interface Package 54 TSOP(II) FUNCTIONAL BLOCK DIAGRAM I/O Control LWE Data Input Register LDQM Bank Select 2M x 16 2M x 16 2M x 16 2M x 16 Refresh Counter Output Buffer Row Decoder Sense AMP Row Buffer DQi Address Register CLK ADD Column Decoder Col.
Buffer LRAS LCBR Latency & Burst Length LCKE LRAS LCBR LWE LCAS Programming Register LWCBR LDQM Timing ...



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