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SI5935DC

Vishay Siliconix
Part Number SI5935DC
Manufacturer Vishay Siliconix
Description Dual P-Channel MOSFET
Published Apr 8, 2005
Detailed Description Dual P-Channel 1.8 V (G-S) MOSFET Si5935DC Vishay Siliconix PRODUCT SUMMARY VDS (V) - 20 RDS(on) (Ω) 0.086 at VGS = ...
Datasheet PDF File SI5935DC PDF File

SI5935DC
SI5935DC

Overview
Dual P-Channel 1.
8 V (G-S) MOSFET Si5935DC Vishay Siliconix PRODUCT SUMMARY VDS (V) - 20 RDS(on) (Ω) 0.
086 at VGS = - 4.
5 V 0.
121 at VGS = - 2.
5 V 0.
171 at VGS = - 1.
8 V ID (A) - 4.
1 - 3.
4 - 2.
9 1206-8 ChipFET® 1 S1 D1 G1 D1 S2 D2 G2 D2 Marking Code DF XX Lot Traceability and Date Code Part # Code FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFETs • Low RDS(on) Dual and Excellent Power Handling in a Compact Footprint • Compliant to RoHS Directive 2002/95/EC APPLICATIONS • Load Switch • PA Switch • Battery Switch S1 S2 G1 G2 Bottom View Ordering Information: Si5935DC-T1-E3 (Lead (Pb)-free) Si5935DC-T1-GE3 (Lead (Pb)-free and Halogen-free) D1 P-Channel MOSFET D2 P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol 5s Steady State Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)b, c TA = 25 °C TA = 85 °C TA = 25 °C TA = 85 °C VDS VGS ID IDM IS PD TJ, Tstg - 20 ±8 - 4.
1 -3 - 2.
9 - 2.
2 - 15 - 1.
8 - 0.
9 2.
1 1.
1 1.
1 0.
6 - 55 to 150 260 Unit V A W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambienta t≤5s Steady State RthJA 50 90 60 110 °C/W Maximum Junction-to-Foot (Drain) Steady State RthJF 30 40 Notes: a.
Surface mounted on 1" x 1" FR4 board.
b.
See reliability manual for profile.
The ChipFET is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
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