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TEA1566S

NXP
Part Number TEA1566S
Manufacturer NXP
Description GreenChip; SMPS module
Published Apr 16, 2005
Detailed Description INTEGRATED CIRCUITS DATA SHEET TEA1566 GreenChip™; SMPS module Preliminary specification File under Integrated Circuits...
Datasheet PDF File TEA1566S PDF File

TEA1566S
TEA1566S

Overview
INTEGRATED CIRCUITS DATA SHEET TEA1566 GreenChip™; SMPS module Preliminary specification File under Integrated Circuits, IC11 1999 Apr 20 Philips Semiconductors Preliminary specification GreenChip™; SMPS module FEATURES Distinctive features • High level of integration results in 20 to 50 fewer components compared to a power supply with discrete components • On-chip 600 V MOSFET • On/off function replaces expensive mains switch with functional switch • Direct off-line operation (90 to 276 VAC) • On-chip 5% accurate oscillator.
Green features • Low power consumption in off-mode (<100 mW) • On-chip efficient start-up current source giving fast start-up • Burst mode stand-by (<2 W) for overall improved system efficiency • Low power operation mode with lower frequency to reduce switching losses.
Protection features • Demagnetization protection • Cycle by cycle current limitation with programmable current trip level • Over voltage protection • Over temperature protection • Safe-restart mode with reduced power for system fault conditions.
Highly versatile • Usable in Buck and flyback topology • Interfaces both primary and secondary side feedback.
GENERAL DESCRIPTION TEA1566 5 4 3 2 1 9 Vin mains TEA1566 APPLICATIONS output 8 NC 7 6 OOB Dem Gnd Vctrl Iref Vaux Isense MGR691 Fig.
1 Typical flyback application.
The GreenChip™, intended for off-line 90 to 276 VAC power supply applications, is a monolithic high voltage family of ICs that combines analog and digital circuits to implement all necessary control functions for a switched mode power supply.
The functions include integrated high voltage start-up current source, voltage mode PWM control, 5% accurate trimmed oscillator, band gap derived reference voltages, comprehensive fault protection, and leading edge blanking.
High level of integration leads to cost effective power supplies that are compact, weigh less, and at the same time give higher efficiency, are more reliable and simple to design.
Efficient green featu...


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