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TGA1319C

TriQuint Semiconductor
Part Number TGA1319C
Manufacturer TriQuint Semiconductor
Description Ka Band Wideband LNA/Driver
Published Apr 16, 2005
Detailed Description Advance Product Information August 29, 2000 Ka Band Wideband LNA/Driver TGA1319C Key Features and Performance • • • •...
Datasheet PDF File TGA1319C PDF File

TGA1319C
TGA1319C

Overview
Advance Product Information August 29, 2000 Ka Band Wideband LNA/Driver TGA1319C Key Features and Performance • • • • • • 0.
15um pHEMT Technology 16-30 GHz Frequency Range 2.
25 dB Nominal Noise Figure midband 21 dB Nominal Gain 14 dBm Pout 5V, 60 mA Chip Dimensions 2.
169 mm x .
904 mm Primary Applications • • 3 Point-to-Point Radio Point-to-Multipoint Communications 0 -5 2 .
5 NF (dB) Input RL (dB) -10 -15 -20 -25 -30 2 1 .
5 21 2 1 .
5 22 2 2 .
5 23 2 3 .
5 24 2 4 .
5 25 2 5 .
5 26 Fre q ue n cy 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency ( GHz) Typical NF @ 25C Typical S11 @ 25C 25 20 15 10 5 0 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency ( GHz) 0 -5 Output RL (dB) -10 -15 -20 -25 -30 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency ( GHz) Gain (dB) Typical Gain @ 25C Typical S22 @ 25C Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications.
Specifications subject to change without notice TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.
triquint.
com 1 Advance Product Information August 29, 2000 TGA1319C RFin RFout TGA1319C- Recommended Assembly Drawing Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications.
Specifications subject to change without notice TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.
triquint.
com Advance Product Information August 29, 2000 TGA1319C Assembly Process Notes Reflow process assembly notes: •= •= •= •= •= AuSn (80/20) solder with limited exposure to temperatures at or above 300ΓC alloy station or conveyor furnace with reducing atmosphere no fluxes should be utilized coefficient of thermal expansion matching is critical for long-term reliability stor...


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