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HYE18L256160BC-75

Infineon
Part Number HYE18L256160BC-75
Manufacturer Infineon
Description DRAMs for Mobile Applications
Published Apr 23, 2005
Detailed Description Infineon Specialty DRAMs Mobile-RAM w w w. i n f i n e o n . c o m / m e m o r y / Mo b i l e - R A M Never stop think...
Datasheet PDF File HYE18L256160BC-75 PDF File

HYE18L256160BC-75
HYE18L256160BC-75

Overview
Infineon Specialty DRAMs Mobile-RAM w w w.
i n f i n e o n .
c o m / m e m o r y / Mo b i l e - R A M Never stop thinking.
Impressive Power Consumption Savings I N F I N E O N ’ S M O B I L E - R A M devices achieve these dramatic power consumption savings by measuring the temperature with an integrated sensor and automatically adjusting the refresh interval accordingly.
F O R U S E R S , this means that their devices can either run twice as long on a single battery charge or can offer completely new features that would have been previously unthinkable.
The fact that nearly half of all PDAs produced today contain Mobile-RAMs from Infineon confirms the company’s pioneering role in this segment.
Mobile-RAM for Lowest Power Consumption also in Operating Mode 281 mW 100 % 215 mW 77 % 100 % Power consumption 163 mW 58 % 76 % 100 % 108 mW 38 % 50 % 66 % 3.
3 V - 256 M 85 mA* 3.
3 V - 256 M 65 mA* 2.
5 V - 256 M 65 mA* 1.
8 V - 256 M 60 mA* Mobile-RAM for Unlimited Memory Supply in Standby Mode Ahead of the Trend 2003 3.
3 V 2004 2005 Voltage conversion 2.
5 V 1.
8 V Trend towards green package TSOP Trend towards KGD BGA FGBA Known Good Die SDR Trend towards DDR DDR Source: IFX M A N U F A C T U R E R S A R E C H A L L E N G E D to lower core and I/O voltage in order to further reduce power consumption.
Compared with the 2.
5 V technology previously in use, Infineon’s next-generation 1.
8 V technology meets these demands by cutting power consumption by approximately 40 %.
T H E M A R K E T I S A L S O C A L L I N G for a reduction in harmful substances, the elimination of lead in chips and easier recycling.
Infineon is one of the first manufacturers to offer Mobile-RAM chips in green packages.
I N A N T I C I P A T I O N O F R I S I N G demand for cost-optimized multi-chip solutions, (combining flash and Mobile-RAM) Infineon will also soon be introducing a pre-tested Known Good Die (KGD) / wafer solution.
A N D T O R E D U C E P O W E R consumption even...


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