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HYM721000GS-60

Siemens
Part Number HYM721000GS-60
Manufacturer Siemens
Description 1M x 72-Bit Dynamic RAM Module
Published Apr 23, 2005
Detailed Description 1M × 72-Bit Dynamic RAM Module (ECC - Module) HYM 721000GS-60/-70 HYM 721010GS-60/-70 Advanced Information • • 1 048 ...
Datasheet PDF File HYM721000GS-60 PDF File

HYM721000GS-60
HYM721000GS-60

Overview
1M × 72-Bit Dynamic RAM Module (ECC - Module) HYM 721000GS-60/-70 HYM 721010GS-60/-70 Advanced Information • • 1 048 576 words by 72-bit ECC - mode organization Fast access and cycle time 60 ns access time 110 ns cycle time (-60 version) 70 ns access time 130 ns cycle time (-70 version) Fast page mode capability with 40 ns cycle time (-60 version) 45 ns cycle time (-70 version) Single + 5 V (± 10 %) supply Low power dissipation max.
10890 mW active (-60 version) max.
9900 mW active (-70 version) CMOS – 451 mW standby TTL – 550 mW standby • • • • • • • • • • CAS-before-RAS refresh, RAS-only-refresh 18 decoupling capacitors mounted on substrate All inputs, outputs and clock fully TTL compatible 4 Byte interleave enabled, Dual Address inputs (A0/B0) Buffered inputs excepts RAS and DQ 168 pin, dual read-out, Single in-Line Memory Module Utilizes eighteen 1M × 4 -DRAMs in TSOPII-packages and four BiCMOS 8-bit buffers/line drivers 74ABT244 Two versions: HYM 721000GS with TSOPII-components (4.
06 mm module thickness) HYM 721010GS with SOJ-components (8.
89 mm module thickness) 1024 refresh cycles / 16 ms Gold contact pad double sided module with 25.
35 mm (1000 mil) height • • • • Semiconductor Group 1 12.
95 HYM721000/10GS-60/-70 1M x 72 ECC- Module The HYM 721000GS-60/-70 is a 8 MByte DRAM module organized as 1 048 576 words by 72-bit in a 168-pin, dual read-out, single-in-line package comprising eighteen HYB 514400BT 1M × 4 DRAMs in 300 mil wide TSOPII - packages mounted together with eighteen 0.
2 µF ceramic decoupling capacitors on a PC board.
All inputs except RAS and DQ are buffered by using four BiCMOS 8-bit buffers/line drivers.
Each HYB 514400BT is described in the data sheet and is fully electrically tested and processed according to Siemens standard quality procedure prior to module assembly.
After assembly onto the board, a further set of electrical tests is performed.
The density and speed of the module can be detected by the use of presence detect p...


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