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MC14050B

ON Semiconductor
Part Number MC14050B
Manufacturer ON Semiconductor
Description Hex Buffer
Published Apr 26, 2005
Detailed Description Hex Buffer MC14049B, MC14050B The MC14049B Hex Inverter/Buffer and MC14050B Noninverting Hex Buffer are constructed wi...
Datasheet PDF File MC14050B PDF File

MC14050B
MC14050B

Overview
Hex Buffer MC14049B, MC14050B The MC14049B Hex Inverter/Buffer and MC14050B Noninverting Hex Buffer are constructed with MOS P−Channel and N−Channel enhancement mode devices in a single monolithic structure.
These complementary MOS devices find primary use where low power dissipation and/or high noise immunity is desired.
These devices provide logic level conversion using only one supply voltage, VDD.
The input−signal high level (VIH) can exceed the VDD supply voltage for logic level conversions.
Two TTL/DTL loads can be driven when the devices are used as a CMOS−to−TTL/DTL converter (VDD = 5.
0 V, VOL ≤ 0.
4 V, IOL ≥ 3.
2 mA).
Note that pins 13 and 16 are not connected internally on these devices; consequently connections to these terminals will not affect circuit operation.
Features • High Source and Sink Currents • High−to−Low Level Converter • Supply Voltage Range = 3.
0 V to 18 V • VIN can exceed VDD • Meets JEDEC B Specifications • Improved ESD Protection On All Inputs • NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable • These Devices are Pb−Free and are RoHS Compliant MAXIMUM RATINGS (Voltages Referenced to VSS) Symbol Parameter Value Unit VDD DC Supply Voltage Range −0.
5 to +18.
0 V Vin Input Voltage Range (DC or Transient) −0.
5 to +18.
0 V Vout Output Voltage Range (DC or Transient) −0.
5 to VDD + V 0.
5 Iin Input Current (DC or Transient) per Pin ± 10 mA Iout Output Current (DC or Transient) per Pin ± 45 mA PD Power Dissipation, per Package (Note 1) mW (Plastic) 825 (SOIC) 740 TA Ambient Temperature Range −55 to +125 °C Tstg Storage Temperature Range −65 to +150 °C TL Lead Temperature (8−Second Soldering) 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device.
If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1.
Temperature D...


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