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MA4P1450

Tyco
Part Number MA4P1450
Manufacturer Tyco
Description Surface Mount PIN Diodes
Published Apr 27, 2005
Detailed Description Surface Mount PIN Diodes Features q q q q q q q MA4P1250, MA4P1450 SMQ™ V3.00 Non-Rollable MELF Design Hermetically Se...
Datasheet PDF File MA4P1450 PDF File

MA4P1450
MA4P1450

Overview
Surface Mount PIN Diodes Features q q q q q q q MA4P1250, MA4P1450 SMQ™ V3.
00 Non-Rollable MELF Design Hermetically Sealed Low Loss, Low Distortion Passivated PIN Diode Chips Full Face Chip Bonds Non-Magnetic Package Pick and Place Compatibility Size, Inches (mm) Model No.
MA4P1250 MA4P1450 Case Style 1072 1091 A(sq.
) Min.
/Max.
0.
080/0.
095 (2.
03/2.
41) 0.
138/0.
155 (3.
51/3.
94) B Min.
/Max.
0.
115/0.
135 (2.
92/3.
43) 0.
180/0.
200 (4.
57/5/08) C Min.
/Max.
0.
008/0.
030 (0.
203/0.
762) Description The MA4P1250 and MA4P1450 are square surface mountable PIN diodes in a non-rollable, metal electrode leadless faced (MELF) package.
They incorporate passivated PIN diode chips that are full face bonded to refractory metal pins.
These parts utilize M/A-COM’s HIPAX technology in a low inductance ceramic package with no ribbons or whisker wires.
The package is hermetically sealed at temperatures exceeding 300˚C.
Applications The MA4P1250 is designed for use as a low loss switching element from HF through UHF.
Its high power rating allows performance in antenna switch elements at RF power levels greater than 100 watts CW.
It is designed to meet the low distortion requirements of mobile radios.
The MA4P1450 is a higher power diode.
It has lower distortion at RF CW power greater than 10 watts and can dissipate 7.
5 watts.
FULL FACE BOND PASSIVATED PIN DIODE CHIP Designed for Automated Assembly These surface mount PIN diodes are designed for high volume tape and reel assembly.
The square package eases automatic pick and place indexing and assembly.
The parallel flat surfaces are suitable for key jaw or vacuum pickup techniques.
All solderable surfaces are tin plated and compatible with reflow and vapor phase soldering methods.
CERAMIC SOLDERABLE SURFACES Environmental Capability These HIPAX diodes are applicable for use in industrial and military applications.
They can meet the environmental requirements of MIL-STD-750 and MIL-STD-202 or be screened to JAN-TX and other high reliability s...


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