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74LVTH16374

Fairchild Semiconductor
Part Number 74LVTH16374
Manufacturer Fairchild Semiconductor
Description Low Voltage 16-Bit D-Type Flip-Flop
Published Mar 22, 2005
Detailed Description 74LVT16374 • 74LVTH16374 Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs January 1999 Revised April 1999 74LV...
Datasheet PDF File 74LVTH16374 PDF File

74LVTH16374
74LVTH16374


Overview
74LVT16374 • 74LVTH16374 Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs January 1999 Revised April 1999 74LVT16374 • 74LVTH16374 Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs General Description The LVT16374 and LVTH16374 contain sixteen non-inverting D-type flip-flops with 3-STATE outputs and is intended for bus oriented applications.
The device is byte controlled.
A buffered clock (CP) and Output Enable (OE) are common to each byte and can be shorted together for full 16-bit operation.
The LVTH16374 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs.
These flip-flops are designed for low-voltage (3.
3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment.
The LVT16374 and LVTH16374 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining a low power dissipation.
Features s Input and output interface capability to systems at 5V VCC s Bushold data inputs eliminate the need for external pullup resistors to hold unused inputs (74LVTH16374), also available without bushold feature (74LVT16374).
s Live insertion/extraction permitted s Power Up/Down high impedance provides glitch-free bus loading s Outputs source/sink −32 mA/+64 mA Ordering Code: Order Number 74LVT16374MEA 74LVT16374MTD 74LVTH16374MEA 74LVTH16374MTD Package Number MS48A MTD48 MS48A MTD48 Package Description 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.
300” Wide 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.
1mm Wide 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.
300” Wide 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.
1mm Wide Device also available in Tape and Reel.
Specify by appending suffix letter “X” to the ordering code.
Logic Symbol © 1999 Fairchild Semiconductor Corporation DS012022.
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