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NTP60N06G

ON Semiconductor
Part Number NTP60N06G
Manufacturer ON Semiconductor
Description Power MOSFET
Published May 13, 2005
Detailed Description NTP60N06, NTB60N06 Power MOSFET 60 V, 60 A, N−Channel TO−220 and D2PAK Designed for low voltage, high speed switching ap...
Datasheet PDF File NTP60N06G PDF File

NTP60N06G
NTP60N06G


Overview
NTP60N06, NTB60N06 Power MOSFET 60 V, 60 A, N−Channel TO−220 and D2PAK Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.
Features http://onsemi.
com • Pb−Free Packages are Available Typical Applications 60 VOLTS, 60 AMPERES RDS(on) = 14 mW N−Channel D • • • • Power Supplies Converters Power Motor Controls Bridge Circuits G S Value 60 60 "20 "30 60 42.
3 180 150 1.
0 2.
4 −55 to +175 454 Adc Apk W W/°C W °C mJ 4 MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Drain−to−Source Voltage Drain−to−Gate Voltage (RGS = 10 MW) Gate−to−Source Voltage − Continuous − Non−Repetitive (tpv10 ms) Drain Current − Continuous @ TA = 25°C − Continuous @ TA = 100°C − Single Pulse (tpv10 ms) Total Power Dissipation @ TA = 25°C Derate above 25°C Total Power Dissipation @ TA = 25°C (Note 1) Operating and Storage Temperature Range Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 75 Vdc, VGS = 10 Vdc, L = 0.
3 mH IL(pk) = 55 A, VDS = 60 Vdc) Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds Symbol VDSS VDGR VGS VGS ID ID IDM PD Unit Vdc Vdc Vdc 4 MARKING DIAGRAMS 4 Drain TO−220 CASE 221A STYLE 5 NTx60N06 AYWW 1 2 3 1 Gate 2 Drain 4 Drain D2PAK CASE 418B STYLE 2 3 Source TJ, Tstg EAS 2 NTx60N06 AYWW °C/W RqJC RqJA TL 1.
0 62.
5 260 °C 3 2 1 3 Drain Gate Source NTx60N06 x A Y WW = Device Code = P or B = Assembly Location = Year = Work Week Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously.
If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1.
When surface mounted to an FR4 board using minimum recommended pad size, (Cu Area 0.
412 in2).
...


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