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27C512A

Microchip Technology
Part Number 27C512A
Manufacturer Microchip Technology
Description 512K (64K x 8) CMOS EPROM
Published May 28, 2005
Detailed Description 27C512A 512K (64K x 8) CMOS EPROM FEATURES • High speed performance • CMOS Technology for low power consumption - 25 mA ...
Datasheet PDF File 27C512A PDF File

27C512A
27C512A

Overview
27C512A 512K (64K x 8) CMOS EPROM FEATURES • High speed performance • CMOS Technology for low power consumption - 25 mA Active current - 30 µA Standby current • Factory programming available • Auto-insertion-compatible plastic packages • Auto ID aids automated programming • High speed express programming algorithm • Organized 64K x 8: JEDEC standard pinouts - 28-pin Dual-in-line package - 32-pin PLCC Package - 28-pin SOIC package - 28-pin TSOP package - 28-pin VSOP package - Tape and reel • Data Retention > 200 years • Available for the following temperature ranges - Commercial: 0˚C to +70˚C - Industrial: -40˚C to +85˚C - Automotive: -40˚C to +125˚C PACKAGE TYPES TSOP OE/VPP A11 A9 A8 A13 A14 VCC A15 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 CE D7 D6 D5 D4 D3 VSS D2 D1 D0 A0 A1 A2 27C512A 4 3 2 1 32 31 30 A7 A12 A15 NU Vcc A14 A13 PLCC A6 A5 A4 A3 A2 A1 A0 NC O0 5 6 29 28 8 9 10 11 12 13 14 15 27C512A 7 27 26 25 24 23 22 21 A8 A9 A11 NC OE/VPP A10 CE O7 O6 16 17 18 19 DIP/SOIC A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 VSS O1 O2 VSS NU O3 O4 O5 DESCRIPTION The Microchip Technology Inc.
27C512A is a CMOS 512K bit electrically Programmable Read Only Memory (EPROM).
The device is organized into 64K words by 8 bits (64K bytes).
Accessing individual bytes from an address transition or from power-up (chip enable pin going low) is accomplished in less than 90 ns.
This very high speed device allows the most sophisticated microprocessors to run at full speed without the need for WAIT states.
CMOS design and processing enables this part to be used in systems where reduced power consumption and high reliability are requirements.
A complete family of packages is offered to provide the most flexibility in applications.
For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available.
Tape or reel packaging is also available for PLCC or SOIC packages.
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