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SO14

ST Microelectronics
Part Number SO14
Manufacturer ST Microelectronics
Description SO 14
Published May 28, 2005
Detailed Description ® Thermal Data SO 14 14 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/...
Datasheet PDF File SO14 PDF File

SO14
SO14

Overview
® Thermal Data SO 14 14 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.
61 W/cm°C 0.
01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.
20 mm 10-40 µm molding compound 1.
65 mm 0.
0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data SO 14 Rth(j-a) (ºC/W) 220 die size = 60 x 90 sq.
mils 1) 200 180 floating in air 160 mounted on : 140 SM PCB1A SGS board 120 SM PCB1 SGS board 100 alumina 80 0 0.
2 0.
4 0.
6 0.
8 1 1.
2 dissipated power ( Watt ) 1.
4 1.
6 1.
8 2 Transient Thermal Resistance (ºC/W) 200 SINGLE PULSE 100 mounted on SM PCB1 SGS board Pd = 1,5 Watt 50 2) 20 10 die size = 60 x 90 sq.
mils on die dissipating area = 2000 sq.
mils 5 2 1 0.
001 0.
01 0.
1 1 Time or pulse width ( s ) 10 100 1,000 2/2  ...


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