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SOT416

NXP
Part Number SOT416
Manufacturer NXP
Description Package outline
Published May 28, 2005
Detailed Description Philips Semiconductors Package outline Plastic surface mounted package; 3 leads SOT416 D B E A X v M A HE 3 ...
Datasheet PDF File SOT416 PDF File

SOT416
SOT416

Overview
Philips Semiconductors Package outline Plastic surface mounted package; 3 leads SOT416 D B E A X v M A HE 3 Q A 1 e1 e bp 2 w M B A1 c Lp detail X 0 0.
5 scale 1 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 0.
95 0.
60 A1 max 0.
1 bp 0.
30 0.
15 c 0.
25 0.
10 D 1.
8 1.
4 E 0.
9 0.
7 e 1 e1 0.
5 HE 1.
75 1.
45 Lp 0.
45 0.
15 Q 0.
23 0.
13 v 0.
2 w 0.
2 OUTLINE VERSION SOT416 REFERENCES IEC JEDEC JEITA SC-75 EUROPEAN PROJECTION ISSUE DATE 97-02-28 04-11-04 SOT416 © Koninklijke Philips Electronics N.
V.
2004.
All rights reserved.
PDF 4 November 2004 1 of 1 ...


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