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HDF480A

Shoulder
Part Number HDF480A
Manufacturer Shoulder
Description SAW Filter
Published Jul 13, 2005
Detailed Description Approved by: Checked by: Issued by: SPECIFICATION PRODUCT: MODEL: SAW FILTER HDF480A TO-39 SHOULDER ELECTRONICS LIMI...
Datasheet PDF File HDF480A PDF File

HDF480A
HDF480A


Overview
Approved by: Checked by: Issued by: SPECIFICATION PRODUCT: MODEL: SAW FILTER HDF480A TO-39 SHOULDER ELECTRONICS LIMITED SHOULDER ELECTRONICS LIMITED 1.
SCOPE This specification shall cover the characteristics of SAW filter with 480MHz used for DBS receiver.
2.
ELECTRICAL SPECIFICATION DC Voltage VDC AC Voltage Vpp Operation temperature Storage temperature RF Power Dissipation 10V 10V50Hz/60Hz -20¡æto +60¡æ -45¡æto +85¡æ 0dBm Electronic Characteristics 2-1.
Typical frequency response 2-2.
Electrical characteristics Part number Center frequency fo Insertion Loss: Fo: Fo¡À 39.
8~45.
8MHz fo¡À 45.
8~100.
0MHz Passband width( -3dB) Ripple(Fo¡À 4.
0MHz) Group delay Group delay ripple Input/Output impedance F480A 480.
000 4.
5max 45.
0min 50.
0min 9.
0 type 2.
0max 100 100 50//0 Unit MHz dB MHz dB ns ns ¦¸ //pF SHOULDER ELECTRONICS LIMITED (Note: Operating te mperature Range:-20¡æto +60¡æ ) 3.
TEST CIRCUIT 4.
DIMENSION 5.
ENVIRONMENTAL CHARACTERISTICS 5-1 High temperature exposure Subject the device to +85¡æfor 16 hours.
Then release the filter into the room conditions for 24 hours prior to the measurement.
It shall fulfill the specifications in table 1.
5-2 Low temperature exposure SHOULDER ELECTRONICS LIMITED Subject the device to -20¡æfor 16 hours.
Then release the device into the room conditions for 24 hours prior to the measurement.
It shall fulfill the specifications in table 1.
5-3 Temperature cycling Subject the device to a low temperature of -40¡æ for 30 minutes.
Following by a high temperature of +80¡æfor 30 Minutes.
Then release the device into the room conditions for 24 hours prior to the measurement.
It shall meet the specifications in table 1.
5-4 Resistance to solder heat Dip the device terminals no closer than 1.
5mm into the solder bath at 260¡æ ¡À 10¡æfor 10¡À 1 sec.
Then release the device into the room conditions for 4 hours.
The device shall meet the specifications in table 1.
5-5 Solderability Subject the device terminals into the solder bath at 245¡...



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