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MSC3130T1

Motorola
Part Number MSC3130T1
Manufacturer Motorola
Description NPN RF Amplifier Transistors Surface Mount
Published Sep 9, 2005
Detailed Description MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MSC3130T1/D NPN RF Amplifier Transistor Surface Mount M...
Datasheet PDF File MSC3130T1 PDF File

MSC3130T1
MSC3130T1

Overview
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MSC3130T1/D NPN RF Amplifier Transistor Surface Mount MSC3130T1 Motorola Preferred Device COLLECTOR 3 3 2 1 2 BASE 1 EMITTER Unit Vdc Vdc Vdc mAdc CASE 318D–03, STYLE 1 SC–59 MAXIMUM RATINGS (TA = 25°C) Rating Collector–Base Voltage Collector–Emitter Voltage Emitter–Base Voltage Collector Current — Continuous Symbol VCBO VCEO VEBO IC Value 15 10 3.
0 50 THERMAL CHARACTERISTICS Characteristic Power Dissipation Junction Temperature Storage Temperature Symbol PD TJ Tstg Max 200 150 – 55 ~ +150 Unit mW °C °C ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Collector Cutoff Current (VCB = 10 Vdc, IE = 0) Collector–Emitter Breakdown Voltage (IC = 2.
0 mAdc, IB = 0) Emitter–Base Breakdown Voltage (IE = 10 µAdc, IC = 0) DC Current Gain(1) (VCE = 4.
0 Vdc, IC = 5.
0 mAdc) Collector–Emitter Saturation Voltage (IC = 20 mAdc, IB = 4.
0 mAdc) Current–Gain — Bandwidth Product (VCB = 4.
0 Vdc, IE = –5.
0 mAdc) 1.
Pulse Test: Pulse Width ≤ 300 µs, D.
C.
≤ 2%.
Symbol ICBO VCEO VEBO hFE VCE(sat) fT Min — 10 3.
0 75 — 1.
4 Max 1.
0 — — 400 0.
5 2.
5 Unit µAdc Vdc Vdc — Vdc GHz DEVICE MARKING Marking Symbol 1SX The “X” represents a smaller alpha digit Date Code.
The Date Code indicates the actual month in which the part was manufactured.
Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value.
© Motorola, Inc.
1996 Motorola Small–Signal Transistors, FETs and Diodes Device Data 1 MSC3130T1 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design.
The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0.
037 0.
95 interface between the board and the package.
With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.
037 0.
95 0.
098–0.
118 2.
5–3.
0 0.
094 2.
4 0.
039 1.
0 ...


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