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NTHS5443

ON Semiconductor
Part Number NTHS5443
Manufacturer ON Semiconductor
Description P-Channel MOSFET
Published Sep 23, 2005
Detailed Description NTHS5443 MOSFET – Power, P-Channel, ChipFET -20 V, -4.9 A Features • Low RDS(on) for Higher Efficiency • Logic Level Ga...
Datasheet PDF File NTHS5443 PDF File

NTHS5443
NTHS5443

Overview
NTHS5443 MOSFET – Power, P-Channel, ChipFET -20 V, -4.
9 A Features • Low RDS(on) for Higher Efficiency • Logic Level Gate Drive • Miniature ChipFET Surface Mount Package Saves Board Space • Pb−Free Package is Available Applications • Power Management in Portable and Battery−Powered Products; i.
e.
, Cellular and Cordless Telephones and PCMCIA Cards MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Steady Symbol 5 secs State Unit Drain−Source Voltage Gate−Source Voltage Continuous Drain Current (TJ = 150°C) (Note 1) TA = 25°C TA = 85°C Pulsed Drain Current Continuous Source Current (Note 1) Maximum Power Dissipation (Note 1) TA = 25°C TA = 85°C Operating Junction and Storage Temperature Range VDS VGS ID IDM IS PD TJ, Tstg −20 "12 −4.
9 −3.
6 −3.
5 −2.
6 "15 −4.
9 −3.
6 2.
5 1.
3 1.
3 0.
7 −55 to +150 V V A A A W °C Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously.
If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1.
Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.
27 in sq [1 oz] including traces).
http://onsemi.
com V(BR)DSS −20 V RDS(on) TYP 56 mW @ −4.
5 ID MAX −4.
9 A S G D P−Channel MOSFET 8 1 ChipFET CASE 1206A STYLE 1 PIN CONNECTIONS MARKING DIAGRAM D8 D7 D6 S5 1D 2D 3D 4G 1 2 3 4 A4 MG G 8 7 6 5 A4 = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† NTHS5443T1 ChipFET 3000/Tape & Reel NTHS5443T1G ChipFET (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005 May, 2019 − Rev.
6 1 Publication Order...


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