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SI7909DN

Vishay Siliconix
Part Number SI7909DN
Manufacturer Vishay Siliconix
Description Dual P-Channel 12-V (D-S) MOSFET
Published Sep 24, 2005
Detailed Description Si7909DN New Product Vishay Siliconix Dual P-Channel 12-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (Ω) 0.037 @ VG...
Datasheet PDF File SI7909DN PDF File

SI7909DN
SI7909DN

Overview
Si7909DN New Product Vishay Siliconix Dual P-Channel 12-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (Ω) 0.
037 @ VGS = –4.
5 V –12 0.
048 @ VGS = –2.
5 V 0.
068 @ VGS = –1.
8 V ID (A) –7.
7 –6.
8 –5.
7 FEATURES • TrenchFET® Power MOSFETS: 1.
8-V Rated • New Low Thermal Resistance PowerPAK® Package • Advanced High Cell Density Process • Ultra-Low rDS(on), and High PD Capability Pb-free Available RoHS* COMPLIANT APPLICATIONS • • • • Load Switch PA Switch Battery Switch Bi-Directional Switch S1 S2 PowerPAK 1212-8 3.
30 mm S1 1 2 3.
30 mm G1 S2 3 4 D1 G2 G1 G2 8 7 D1 D2 6 5 D2 Bottom View D1 P-Channel MOSFET D2 P-Channel MOSFET Ordering Information: Si7909DN-T1 Si7909DN–T1–E3 (Lead (Pb)–free) ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150°C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) b,c Symbol VDS VGS TA = 25°C TA = 85°C ID IDM IS TA = 25°C TA = 85°C PD TJ, Tstg 10 secs –12 ±8 –7.
7 –5.
5 –20 –2.
3 2.
8 1.
5 Steady State Unit V –5.
3 –3.
8 –1.
1 1.
3 0.
85 –55 to 150 260 A W °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambienta t ≤ 10 sec Steady State Steady State Symbol RthJA Typical 35 75 4 Maximum 44 94 5 Unit °C/W Maximum Junction-to-Case RthJC Notes a.
Surface Mounted on 1“ x 1“ FR4 Board.
b.
See Solder Profile (http://www.
vishay.
com/ppg?73257).
The PowerPAK 1212-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c.
Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
* Pb containing terminations are not RoHS compliant, exe...


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