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MT48LC16M16LFBG

Micron Technology
Part Number MT48LC16M16LFBG
Manufacturer Micron Technology
Description 256M x 16 Mobile SDRAM
Published Apr 8, 2006
Detailed Description PRELIMINARY‡ 256Mb: x16 MOBILE SDRAM MOBILE SDRAM FEATURES • Temperature Compensated Self Refresh (TCSR) • Fully synch...
Datasheet PDF File MT48LC16M16LFBG PDF File

MT48LC16M16LFBG
MT48LC16M16LFBG

Overview
PRELIMINARY‡ 256Mb: x16 MOBILE SDRAM MOBILE SDRAM FEATURES • Temperature Compensated Self Refresh (TCSR) • Fully synchronous; all signals registered on positive edge of system clock • Internal pipelined operation; column address can be changed every clock cycle • Internal banks for hiding row access/precharge • Programmable burst lengths: 1, 2, 4, 8, or full page • Auto Precharge, includes CONCURRENT AUTO PRECHARGE and Auto Refresh Modes • Self Refresh Mode • 64ms, 8,192-cycle refresh • LVTTL-compatible inputs and outputs • Low voltage power supply • Deep Power Down • Partial Array Self Refresh power-saving mode MT48LC16LFFG, MT48LC16M16LFBG, MT48V16MLFFG, MT48V16M16LFBG, MT48H16M16LFFG, MT48H16M16LFBG 4 Meg x 16 x 4 banks For the latest data sheet revisions, please refer to the Micron Web site: www.
micron.
com/dramds BALL ASSIGNMENT (Top View) 54-Ball VFBGA 1 A B C D E F VSS DQ14 DQ12 DQ10 DQ8 UDQM A12 A8 VSS 2 DQ15 DQ13 DQ11 DQ9 NC CK A11 A7 A5 3 VSSQ VDDQ VSSQ VDDQ VSS CKE A9 A6 A4 4 5 6 7 VDDQ VSSQ VDDQ VSSQ VDD CAS\ BA0 A0 A3 8 DQ0 DQ2 DQ4 DQ6 LDQM RAS\ BA1 A1 A2 9 VDD DQ1 DQ3 DQ5 DQ7 WE\ CS\ A10 VDD OPTIONS MARKING • V DD /V DD Q 3.
3V/3.
3V LC 2.
5V/2.
5V–1.
8V V 1.
8V/1.
8V H • Configurations 16 Meg x 16 (4 Meg x 16 x 4 banks) 16M16 • Plastic Packages – OCPL 54-pinTSOP (400 mil)1 TG 54-pinTSOP (400 mil) Lead-Free1 P 54-ball VFBGA (8mm x 14mm)2 FG 54-ball VFBGA (8mm x 14mm) Lead-Free2 BG • Timing (Cycle Time) 8.
0ns @ CL = 3 (125 MHz) -8 10ns @ CL = 3 (100 MHz) -10 • Operating Temperature Commercial (0oC to + 70oC) None IT Industrial (-40oC to + 85oC) NOTE: 1.
Contact Factory for availability.
2.
Due to space limitations, FBGA-packaged components have an abbreviated part mark that is different from the part number.
See our Web site for more information on abbreviated component marks.
G H J Configuration Refresh Count Row Addressing Bank Addressing Column Addressing 16 Meg x 16 4 Meg x 16 x 4 banks 8K 8K (A0–A12) 4 (BA0, BA1) 512 (A0–A8) KEY TIMING PARAMETER...


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