DatasheetsPDF.com

QFSS-052-01-H-D-A-PC4

Samtec
Part Number QFSS-052-01-H-D-A-PC4
Manufacturer Samtec
Description High Speed Shielded Socket
Published Jul 19, 2006
Detailed Description www.DataSheet4U.com Project Number: NA Requested by: Brian Niehoff Part #: QFSS-052-01-H-D-PC4 Part description: High S...
Datasheet PDF File QFSS-052-01-H-D-A-PC4 PDF File

QFSS-052-01-H-D-A-PC4
QFSS-052-01-H-D-A-PC4

Overview
www.
DataSheet4U.
com Project Number: NA Requested by: Brian Niehoff Part #: QFSS-052-01-H-D-PC4 Part description: High Speed Shielded Socket Test Start: 6/29/2004 Tracking Code: TC0426--0462 Date: 6/24/2004 Lot #: 1 Product Rev: G / C Tech: Troy Cook Eng: John Tozier Qty to test: 8 Test Completed: 8/2/2004 DataShee DataSheet4U.
com Durability PART DESCRIPTION QFSS-052-01-H-D-PC4 Mated with QMSS-052-11-H-D-PC4 DataSheet4U.
com DataSheet4U.
com DataSheet 4 U .
com www.
DataSheet4U.
com Tracking Code: TC0426--0462 Part #: QFSS-052-01-H-D-PC4 Part description: High Speed Shielded Socket CERTIFICATION All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable.
All contents contained herein are the property of Samtec.
No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec.
SCOPE To perform the following tests: LLCR on both the power pins and the signal pins at 25, 50, 100, 250, 500, and 1000 cycles.
APPLICABLE DOCUMENTS Standards: EIA Publication 364 TEST SAMPLES AND PREPARATION 1) 2) 3) 4) 5) 6) All materials were manufactured in accordance with the applicable product specification.
All test samples were identified and encoded to maintain traceability throughout the test sequences.
After soldering, the parts to be used for LLCR and DWV/IR testing were cleaned according to TLWI-0001.
Either an automated cleaning procedure or an ultrasonic cleaning procedure may be used.
The automated procedure is used with aqueous compatible soldering materials.
The ultrasonic procedure can be used with either aqueous or non-aqueous soldering components and follows: a.
Sample test boards are to be ultrasonically cleaned after test lead attachment, preparation et4U.
com and/or soldering.
DataShee b.
Sample test boards are immersed into Branson 3510 cleaner containing Kyzen Ionox HC1 DataSheet4U.
c...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)