DatasheetsPDF.com

HMPP389x


Part Number HMPP389x
Manufacturer Hewlett-Packard
Title (HMPP-389x) MiniPak Surface Mount RF PIN Switch Diodes
Description Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packag...
Features
• Surface mount MiniPak package
  – low height, 0.7 mm (0.028") max.
  – small footprint, 1.75 mm2 (0.0028 inch2)
• Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and th...

File Size 368.27KB
Datasheet HMPP389x PDF File








Similar Ai Datasheet

HMPP3890 : Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance. Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. • Single and dual versions • Matched diodes for consistent performance • Lo.

HMPP3892 : Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance. Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. • Single and dual versions • Matched diodes for consistent performance • Lo.

HMPP3895 : Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance. Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. • Single and dual versions • Matched diodes for consistent performance • Lo.

HMPP389T : Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance. Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. • Single and dual versions • Matched diodes for consistent performance • Lo.




Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)