DatasheetsPDF.com

NTZD3154N

ON Semiconductor
Part Number NTZD3154N
Manufacturer ON Semiconductor
Description Small Signal MOSFET
Published Aug 26, 2006
Detailed Description www.DataSheet4U.com NTZD3154N Small Signal MOSFET 20 V, 540 mA, Dual N−Channel Features • • • • • • • • • Low RDS(on)...
Datasheet PDF File NTZD3154N PDF File

NTZD3154N
NTZD3154N



Overview
www.
DataSheet4U.
com NTZD3154N Small Signal MOSFET 20 V, 540 mA, Dual N−Channel Features • • • • • • • • • Low RDS(on) Improving System Efficiency Low Threshold Voltage Small Footprint 1.
6 x 1.
6 mm ESD Protected Gate These are Pb−Free Devices http://onsemi.
com V(BR)DSS 20 RDS(on) Typ 400 mW @ 4.
5 V 500 mW @ 2.
5 V 700 mW @ 1.
8 V D1 D2 540 mA ID Max (Note 1) Applications Load/Power Switches Power Supply Converter Circuits Battery Management Cell Phones, Digital Cameras, PDAs, Pagers, etc.
G1 G2 MAXIMUM RATINGS (TJ = 25°C unless otherwise noted.
) Parameter Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain Current (Note 1) Power Dissipation (Note 1) Continuous Drain Current (Note 1) Power Dissipation (Note 1) Pulsed Drain Current Steady State TA = 25°C TA = 85°C Symbol VDSS VGS ID Value 20 ±6.
0 390 250 570 410 280 1.
5 −55 to 150 350 260 mW A °C mA °C G1 2 Symbol RqJA Max 500 447 Unit °C/W D2 3 S1 1 mW mA Unit V V 6 1 SOT−563−6 CASE 463A TV M G S1 N−Channel MOSFET S2 DataSheet4U.
com 540 mA MARKING DIAGRAM TV M G G DataShee Steady State tv5s TA = 25°C TA = 85°C PD ID PD IDM TJ, TSTG IS TL = Specific Device Code = Date Code = Pb−Free Package tv5s tp = 10 ms (Note: Microdot may be in either location) Operating Junction and Storage Temperature Source Current (Body Diode) Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) PINOUT: SOT−563 6 D1 THERMAL RESISTANCE RATINGS Parameter Junction−to−Ambient – Steady State (Note 1) Junction−to−Ambient – t v 5 s (Note 1) 5 G2 4 S2 Top View Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
Surface mounted on FR4 board using 1 in sq pad size (Cu.
area = 1.
127 in sq [1 oz] including traces).
ORDERING INFORMATION See detailed ordering and shipping informa...



Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)