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AM41DL3208G

Part Number	AM41DL3208G
Manufacturer	SPANSION
Description	Stacked Multi-Chip Package (MCP) Flash Memory/SRAM
Published	Sep 7, 2006
Detailed Description	www.DataSheet4U.com Am41DL3208G Data Sheet July 2003 The following document specifies Spansion memory products that ar...
Datasheet	AM41DL3208G PDF File

Overview

www.
DataSheet4U.
com Am41DL3208G Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu.
Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications There is no change to this datasheet as a result of offering the device as a Spansion product.
Any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported.
Future routine revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”.
To order these products, please use only the Ordering Part Numbers listed in this document.
DataShee For More Information DataSheet4U.
com Please contact your local AMD or Fujitsu sales office for additional information about Spansion memory solutions.
Publication Number 25870 Revision A Amendment 0 Issue Date February 13, 2002 DataSheet4U.
com DataSheet 4 U .
com www.
DataSheet4U.
com PRELIMINARY Am41DL3208G Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.
0 Volt-only, Simultaneous Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features I Power supply voltage of 2.
7 to 3.
3 volt I High performance — Access time as fast as 70 ns — 10 mA active read current at 5 MHz — 200 nA in standby or automatic sleep mode I Minimum 1 million write cycles guaranteed per sector I 20 Year data retention at 125°C — Reliable operation for the life of the system I Package — 73-Ball FBGA I Operating Temperature — –40°C to +85°C SOFTWARE FEATURES I Data Management Software (DMS) — AMD-supplied software manages data programming and erasin...

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