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DFLZ10

Diodes Incorporated
Part Number DFLZ10
Manufacturer Diodes Incorporated
Description (DFLZ5V1 - DFLZ39) SURFACE MOUNT POWER ZENER DIODE
Published Nov 18, 2006
Detailed Description www.DataSheet4U.com SPICE MODEL: DFLZ5V1 DFLZ5V6 DFLZ6V2 DFLZ6V8 DFLZ7V5 DFLZ8V2 DFLZ9V1 DFLZ10 DFLZ11 DFLZ12 DFLZ13 DFL...
Datasheet PDF File DFLZ10 PDF File

DFLZ10
DFLZ10

Overview
www.
DataSheet4U.
com SPICE MODEL: DFLZ5V1 DFLZ5V6 DFLZ6V2 DFLZ6V8 DFLZ7V5 DFLZ8V2 DFLZ9V1 DFLZ10 DFLZ11 DFLZ12 DFLZ13 DFLZ15 DFLZ16 DFLZ18 DFLZ20 DFLZ22 DFLZ24 DFLZ27 DFLZ33 DFLZ36 DFLZ39 DFLZ5V1 - DFLZ39 1.
0W SURFACE MOUNT POWER ZENER DIODE PowerDI ä123 Features NEW PRODUCT · · · · 1W Power Dissipation on FR-4 PCB Lead Free Finish, RoHS Compliant (Note 2) "Green" Molding Compound (No Br, Sb) Qualified to AEC-Q101 Standards for High Reliability D H A PowerDIä123 Dim A B C D E C E Min 3.
50 2.
60 1.
63 0.
93 0.
85 0.
15 0.
45 — — — 0.
90 Max 3.
90 3.
00 1.
93 1.
00 1.
25 0.
25 0.
85 — — — 1.
30 Typ 3.
70 2.
80 1.
78 0.
98 1.
00 0.
20 0.
65 1.
35 1.
10 0.
20 1.
05 Mechanical Data · · · · · · · · Case: PowerDIä123 Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminal Connections: Cathode Band Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208 e3 Marking & Type Code Information: See Electrical Specifications Table and Page 3 Ordering Information: See Last Page Weight: 0.
01 grams (approximate) B H L L1 L L1 L2 L3 L4 E L4 A L2 L3 All Dimensions in mm Maximum Ratings Forward Voltage @ TA = 25°C unless otherwise specified Symbol @ IF = 200mA VF Tj, TSTG Value 1.
2 -55 to +150 Unit V °C Characteristic Operating and Storage Temperature Range Thermal Characteristics Characteristic Power Dissipation (Note 1) @ TA = 25°C unless otherwise specified Symbol PD RqJA RqJS Typ ¾ 110 ¾ Max 1.
0 ¾ 9 Unit W °C/W °C/W Thermal Resistance, Junction to Ambient Air (Note 1) Thermal Resistance, Junction to Soldering Point (Note 3) Notes: 1.
Device mounted on 1" x 1", FR-4 PCB; 2 oz.
Cu pad layout as shown on Diodes Inc.
suggested pad layout document AP02001.
pdf.
2.
RoHS revision 13.
2.
2003.
Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
3.
Theoretical RqJS calculated from the top center of the die straight d...


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