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NCV7701

ON Semiconductor
Part Number NCV7701
Manufacturer ON Semiconductor
Description H-Bridge Driver
Published Nov 21, 2006
Detailed Description NCV7701 2.0 Amp H-Bridge Driver This automotive grade H-Bridge driver provides a flexible means for controlling loads r...
Datasheet PDF File NCV7701 PDF File

NCV7701
NCV7701

Overview
NCV7701 2.
0 Amp H-Bridge Driver This automotive grade H-Bridge driver provides a flexible means for controlling loads requiring bidirectional drive currents.
Bridge outputs are protected from overcurrent at each switch and overtemperature shutdown provides product robustness.
The NCV7701 inputs can be interfaced to a range of voltages, including vehicle battery voltage.
The product features a low quiescent current mode, allowing unswitched connection to the power source.
The NCV7701 is produced using ON Semiconductor's POWERSENSEt BCD technology.
Features •ăForward, Reverse, Brake High, Brake Low Modes •ă1.
0 A Output Current Capability (DC) •ăSupply Voltage Range 7.
0 V to 26 V •ă0.
25 W RDS(ON) per Driver @ 25°C •ăSleep Mode (IQ < 10 mA) •ăOvervoltage Protection •ăThermal Protection •ăUndervoltage Disable Function •ăShort Circuit Protection •ăCross Conduction Protection •ăSynchronous Low-Side Rectification for Lower Power Dissipation •ăDiagnostic Output (Open Drain) •ăTTL/CMOS/Pullup to Battery Compatible Inputs •ă20 Lead SO Package with 8 Internally Fused Leads •ăAEC Qualified •ăPPAP Capable •ăThese are Pb-Free Devices* Typical Applications •ăDC Motors •ăStepper Motors •ăModulator Valves http://onsemi.
com MARKING DIAGRAM 20 1 SOIC-20 WB CASE 751D DW SUFFIX NCV7701 AWLYYWWG 1 A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb-Free Package PIN CONNECTIONS 1 VBAT NC OUTB GND GND GND GND FAULT NC NC 20 NC NC OUTA GND GND GND GND EN IN1 IN2 ORDERING INFORMATION Device Package Shipping† NCV7701DWG SOIC-20W (Pb-Free) 38 Units/Rail NCV7701DWR2G SOIC-20W 1000 Tape & Reel (Pb-Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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