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AS5C4009LL

Austin Semiconductor
Part Number AS5C4009LL
Manufacturer Austin Semiconductor
Description 512K x 8 SRAM
Published Jun 5, 2007
Detailed Description SRAM Austin Semiconductor, Inc. 512K x 8 SRAM Ultra Low Power SRAM AVAILABLE AS MILITARY SPECIFICATION • SMD 5962-956131...
Datasheet PDF File AS5C4009LL PDF File

AS5C4009LL
AS5C4009LL

Overview
SRAM Austin Semiconductor, Inc.
512K x 8 SRAM Ultra Low Power SRAM AVAILABLE AS MILITARY SPECIFICATION • SMD 5962-956131,2 • MIL STD-8831 AS5C4009LL PIN ASSIGNMENT (Top View) 32-Pin DIP, 32-Pin SOJ & 32-Pin TSOP FEATURES • Ultra Low Power with 2V Data Retention (0.
2mW MAX worst case Power-down standby) • Fully Static, No Clocks • Single +5V ±10% power supply • Easy memory expansion with CE\ and OE\ options • All inputs and outputs are TTL-compatible • Three state outputs • Operating temperature range: Ceramic -55oC to +125oC & -40oC to +85oC Plastic -40oC to +85oC3 1.
Not applicable to plastic package 2.
Applies to CW package only.
3.
Contact factory for -55oC to +125oC www.
DataSheet4U.
com A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 Vcc A15 A17 WE\ A13 A8 A9 A11 OE\ A10 CE\ I/08 I/07 I/06 I/05 I/04 OPTIONS • Timing 55ns access 70ns access 85ns access 100ns access • Packages Ceramic Dip (600 mil) Ceramic SOJ5 Plastic TSOP MARKING -55 4 -70 -85 -100 CW ECJ DG No.
112 No.
502 No.
1002 I/01 I/02 I/03 Vss 4.
For DG package, contact factory 5.
Contact Factory NOTE: Not all combinations of operating temperature, speed, data retention and low power are necessarily available.
Please contact the factory for availability of specific part number combinations.
GENERAL DESCRIPTION The AS5C4009LL is organized as 524,288 x 8 SRAM utilizing a special ultra low power design process.
ASI’s pinout adheres to the JEDEC standard for pinout on 4 megabit SRAMs.
The evolutionary 32 pin version allows for easy upgrades from the 1 meg SRAM design.
For flexibility in memory applications, ASI offers chip enable (CE\) and output enable (OE\) capabilities.
These features can place the outputs in High-Z for additional flexibility in system design.
This devices operates from a single +5V power supply and all inputs and outputs are fully TTL-compatible.
Writing to these devices is accomplished when write e...


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