DatasheetsPDF.com

84-1LMISR4

Part Number	84-1LMISR4
Manufacturer	ETC
Description	ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE
Published	Jul 11, 2007
Detailed Description	TECHNICAL DATASHEET ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 84-1LMISR4 electrically conductiv...
Datasheet	84-1LMISR4 PDF File

Overview

TECHNICAL DATASHEET ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment.
The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell ABLEBOND® 84-1LMISR4 times, without tailing or stringing problems.
The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
FEATURES • Excellent dispensability with minimal tailing and stringing • Box oven cure Test Method ATM-0018 ATM-0089 ATM-0067 ATM-0068 Test Description 10 x 10 mm Si die on glass slide Test Method ATM-0031 Typical Uncured Properties Filler Type Viscosity @ 25ºC Thixotropic Index www.
DataSheet4U.
com ABLEBOND 84-1LMISR4 Silver 8000 cP 5.
6 18 hours 1 year ABLEBOND 84-1LMISR4 5.
3% 1 hour @ 175ºC Test Description Brookfield CP51 @ 5 rpm Viscosity @ 0.
5/Viscosity @ 5 rpm Physical worklife by % filler Work Life @ 25ºC Storage Life @ -40ºC Cure Process Data Weight Loss on Cure Recommended Cure Condition Alternate Cure Condition (1) (1) 3 - 5ºC / min ramp to 175ºC + 1 hour @ 175ºC The ramp was observed to yield reduced bondline voiding and increased strength The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
PHYSIOCHEMICAL PROPERTIES - Post Cure Ionics Chloride Sodium Potassium ABLEBOND 84-1LMISR4 < 20 ppm < 10 ppm < 10 ppm 13 µmhos/cm 6 0.
35% Test Description Teflon flask, 5 gm sample/20-40 mesh, 50 gm DI water, 100ºC for 24 hours Conductometer pH meter Thermogravimetric analysis Test Method ATM-0007 ATM-0044 ATM-0002 ATM-0073 Water Extract Conductivity pH Weight Loss @ 300ºC The figures shown above are typical values only.
If you need to wri...

Similar Datasheet

84-1LMISR4 ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE - ETC

@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)