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LN189L

Panasonic Semiconductor
Part Number LN189L
Manufacturer Panasonic Semiconductor
Description GaAlAs Infrared Light Emitting Diode
Published Mar 22, 2005
Detailed Description Infrared Light Emitting Diodes LN189L GaAlAs Infrared Light Emitting Diode Unit : mm Light source for distance measuri...
Datasheet PDF File LN189L PDF File

LN189L
LN189L

Overview
Infrared Light Emitting Diodes LN189L GaAlAs Infrared Light Emitting Diode Unit : mm Light source for distance measuring systems 5.
0±0.
3 6.
0±0.
3 3.
4±0.
2 3.
0±0.
2 4.
0±0.
15 1.
0 0.
6 1 0.
4±0.
1 3.
0±0.
15 Features High-power output, high-efficiency : PO = 5.
5 mW (typ.
) Fast response and high-speed modulation capability : tr, tf = 20 ns (typ.
) Infrared light emission close to monochromatic light : λP = 880 nm(typ.
) Narrow directivity using spherical lenses; works well with optical systems in auto focus systems , , , 2 3.
2±0.
15 0.
75 0.
35 Mark (Red) 0.
38 0.
6±0.
1 0.
2 Spherical lens ø0.
55±0.
05 0.
6±0.
1 0.
5±0.
1 1.
5±0.
2 ,, , ,, 0.
15 Mini hollow mold resin package Absolute Maximum Ratings (Ta = 25˚C) Parameter Power dissipation Forward current (DC) Pulse forward current Reverse voltage (DC) Operating ambient temperature Storage temperature * 2.
0±0.
2 1.
5 Symbol PD IF IFP* VR Topr Tstg Ratings 190 100 0.
2 3 –25 to +85 – 40 to +100 Unit mW mA A V ˚C ˚C 0.
1 max.
1.
0 2.
2±0.
15 1: Anode 2: Cathode f = 10 kHz, Duty cycle = 25 % Electro-Optical Characteristics (Ta = 25˚C) Parameter Radiant power Peak emission wavelength Spectral half band width Forward voltage (DC) Reverse current (DC) Rise time Fall time Half-power angle Precautions for Use [Airtightness] This product is not structured to provide a complete air seal.
Therefore it cannot be immersed in solutions for purposes such as boiling tests or ultrasonic cleaning.
[Ability to withstand soldering heat] The package of this product contains thermoplastic resin which has a limited ability to withstand heat.
Therefore this product cannot be put through automated soldering operations in which the ambient temperature exceeds the specified temperature.
The recommended soldering conditions are as follows.
· Temperature of soldering iron tip : 260˚C or less : 300˚C or less or · Soldering time : 5 seconds or less : 1 second or less · Soldering position : At least 2 mm away from lead base Symbol PO λP ∆λ VF IR tr tf θ Conditi...


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