DatasheetsPDF.com

SIGC10T60

Infineon Technologies
Part Number SIGC10T60
Manufacturer Infineon Technologies
Description IGBT
Published Sep 15, 2007
Detailed Description www.DataSheet4U.com SIGC10T60 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off l...
Datasheet PDF File SIGC10T60 PDF File

SIGC10T60
SIGC10T60

Overview
www.
DataSheet4U.
com SIGC10T60 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling 3 This chip is used for: • power module • discrete components Applications: • drives • white goods • resonant applications C G E Chip Type SIGC10T60 VCE 600V ICn 20A Die Size 3.
19 x 3.
21 mm2 Package sawn on foil Ordering Code Q67050A4283-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.
possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Recommended storage environment 3.
19 x 3.
21 2.
004 x 2.
413 0.
361 x 0.
513 10.
2 / 7.
1 70 150 0 1363 pcs Photoimide 3200 nm AlSiCu 1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, <500µm ∅ 0.
65mm ; max 1.
2mm store in original con...


Similar Datasheet


Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)