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LNJ311G8TRA

Panasonic Semiconductor
Part Number LNJ311G8TRA
Manufacturer Panasonic Semiconductor
Description Surface Mounting Chip LED
Published Mar 22, 2005
Detailed Description Light Emitting Diodes This product complies with the RoHS Directive (EU 2002/95/EC). LNJ311G8TRA Surface Mounting Chip...
Datasheet PDF File LNJ311G8TRA PDF File

LNJ311G8TRA
LNJ311G8TRA


Overview
Light Emitting Diodes This product complies with the RoHS Directive (EU 2002/95/EC).
LNJ311G8TRA Surface Mounting Chip LED 3216 Type Forward current IF (mA) (planed maintMeaniantneRcenelaaFttoinyrvcpeweeal/,ruDdimmcisaunciroronutenstneitinnnItauFenen(csdietmiytnAy)c(lpu%e),deplsafnolleodwdiinsgc foontiurnuPreoddtyucptelidf,edciysccloentsitnaugee.
dDisMcaionnttiennuaendtype)ce/  Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Power dissipation PD Forward current IF Pulse forward current * IFP Reverse voltage VR Operating ambient temperature Topr Storage temperature Tstg Note) *: The condition of IFP is duty 10%, Pulse width 1 msec.
60 20 100 4 –30 to +85 –40 to +100 Unit mW mA mA V °C °C  Electro-Optical Characteristics Ta = 25°C Parameter Symbol Conditions Luminous intensity Reverse current Forward voltage Peak emission wavelength Spectral half band width IO IF = 10 mA IR VR = 4 V VF IF = 10 mA λP IF = 10 mA Δλ IF = 10 mA IO  ...


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