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JS28F160B3

Intel
Part Number JS28F160B3
Manufacturer Intel
Description (JS28Fxxx) Advanced Boot Block Flash Memory
Published Nov 14, 2007
Detailed Description www.DataSheet4U.com Intel® Advanced Boot Block Flash Memory (B3) 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datash...
Datasheet PDF File JS28F160B3 PDF File

JS28F160B3
JS28F160B3

Overview
www.
DataSheet4U.
com Intel® Advanced Boot Block Flash Memory (B3) 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 Datasheet Product Features • Flexible SmartVoltage Technology — 2.
7 V – 3.
6 V read/program/erase — 12 V V PP fast production programming • Intel® Flash Data Integrator Software —Flash Memory Manager —System Interrupt Manager —Supports parameter storage, streaming data (for example, voice) • 1.
65 V – .
5 V or 2.
7 V – 3.
6 V I/O option — Reduces overall system power • High Performance — 2.
7 V – 3.
6 V: 70 ns max access time • Extended Cycling Capability —Minimum 100,000 block erase cycles • Optimized Block Sizes — Eight 8-KB blocks for data, top or bottom locations — Up to 127 x 64-KB blocks for code • Automatic Power Savings Feature —Typical ICCS after bus inactivity • Standard Surface Mount Packaging —48-Ball CSP packages —40-Lead and 48-Lead TSOP packages • Block Locking — VCC-level control through Write Protect WP# • Density and Footprint Upgradeable for common package —8-, 16-, 32-, and 64-Mbit densities • Low Power Consumption — 9 mA typical read current • ETOX™ VIII (0.
13 µm) Flash Technology —16-Mbit and 32-Mbit densities • Absolute Hardware-Protection — VPP = GND option — VCC lockout voltage • ETOX™ VII (0.
18 µm) Flash Technology —16-, 32-, and 64-Mbit densities • Extended Temperature Operation — –40 °C to +85 °C • ETOX ™ VI (0.
25µm) Flash Technology —8-, 16-, and 32-Mbit densities • Automated Program and Block Erase — Status registers • Bo not use the x8 option for new designs The Intel® Advanced Boot Block Flash Memory (B3) device, manufactured on the Intel 0.
13 µm and 0.
18 µm technologies, is a feature-rich solution at a low system cost.
The B3 device in x16 is available in 48-lead TSOP and 48-ball CSP packages.
The x8 option of this product family is available only in 40-lead TSOP and 48-ball µBGA* packages.
For additional information about this product family, see the Intel website: http://www.
intel.
com/design/flash.
Notice: ...


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