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GS864272C-xxxV

GSI Technology
Part Number GS864272C-xxxV
Manufacturer GSI Technology
Description (GS8642xxB/C-xxxV) 4M x 18 / 2M x 36/ 1M x 72 72Mb S/DCD Sync Burst SRAMs
Published Jan 3, 2008
Detailed Description www.DataSheet4U.com Preliminary GS864218/36/72(B/C)-xxxV 119- & 209-Pin BGA Commercial Temp Industrial Temp Features ...
Datasheet PDF File GS864272C-xxxV PDF File

GS864272C-xxxV
GS864272C-xxxV

Overview
www.
DataSheet4U.
com Preliminary GS864218/36/72(B/C)-xxxV 119- & 209-Pin BGA Commercial Temp Industrial Temp Features 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs 250 MHz–167 MHz 1.
8 V or 2.
5 V VDD 1.
8 V or 2.
5 V I/O • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.
1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.
8 V or 2.
5 V core power supply • 1.
8 V or 2.
5 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to SCD x18/x36 Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 119- and 209-bump BGA package • RoHS-compliant 119- and 209-bump BGA packages available Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the us...


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